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1. | EXECUTIVE SUMMARY |
1.1. | Why barriers and encapsulation? |
1.2. | Barrier performance requirements (permeation rates) |
1.3. | General approaches towards high performance encapsulation |
1.4. | The basis of the multi-layer approach |
1.5. | Status of R2R barrier films in performance, web width and readiness/scale |
1.6. | Challenges of R2R barrier film productions |
1.7. | From glass to multi-layer films to multi-layer inline thin film encapsulation |
1.8. | TFE is the technology of choice now for plastic and flexible OLED displays |
1.9. | Trends in in-line TFE: reducing thickness by cutting the number of layers in the barrier stack |
1.10. | Trends in TFE: Past, present and future of deposition methods |
1.11. | Atomic layer deposition for encapsulation technology: will it give rise to single layer barrier films? |
1.12. | Flexible glass: an assessment |
1.13. | Benchmarking different barrier solutions |
1.14. | Ten year barrier cost projections for various barrier technologies |
1.15. | Evolution of production parameters to enable multi-layer barrier cost reduction |
1.16. | Ten-year market forecasts in value split by barrier technology |
1.17. | Ten-year market forecasts in sqm split by barrier technology |
1.18. | Ten-year market forecasts in value split by application |
1.19. | Ten-year market forecasts in sqm split by application |
1.20. | Ten-year market forecasts in value split by barrier technology |
1.21. | Ten-year market forecasts in value split by application |
1.22. | Rigid, plastic and flexible OLED displays: market forecasts in sqm split by barrier technologies |
1.23. | Rigid, plastic and flexible OLED displays: market forecast value split by barrier technologies |
1.24. | OLED lighting: Market forecasts in sqm and value split by barrier technology |
1.25. | Quantum dot films: barrier market forecasts in sqm and value split by barrier technology |
1.26. | Flexible CIGS: market forecasts in sqm and value split by barrier technology |
2. | ENCAPSULATION - BASIC REQUIREMENTS |
2.1. | Barrier performance requirements (permeation rates) |
2.2. | Contextualising the scale of the performance challenge |
2.3. | Extrinsic vs intrinsic barrier performance requirements: the challenge for ultra thin single layers or large areas |
2.4. | Barrier requirements: minimising thickness |
2.5. | Barrier requirements: towards flexibility and rollability |
2.6. | Barrier requirements: transparency, chemical resistance, etc. |
3. | ENCAPSULATION - WHY IS IT CHALLENGING TO MEET THE REQUIREMENTS? |
3.1. | Plastic substrates fall short of requirements |
3.2. | The aluminium cathode contact falls short on pinhole density |
3.3. | Diffusion pathways: causes of low impartibility |
3.4. | Diffusion pathways: correlation with pinhole density |
3.5. | Substrate surface topology: cause of imperfection |
3.6. | Barrier properties as a function of the thickness of the deposited film |
3.7. | Built-in stress and optimal thickness |
3.8. | Resistance to scratching/cracking |
4. | BARRIER INTEGRATION TRENDS |
4.1. | Evolution of barrier integration approach |
4.2. | Benchmarking the different barrier integration approaches |
5. | GENERAL SOLUTIONS TO ACHIEVING SUFFICIENT ENCAPSULATION |
5.1. | General approaches towards high performance encapsulation |
5.2. | Barrier films: will single barriers ever work? |
5.3. | The basis of the multi-layer approach |
5.4. | Multi-layer dyad based barriers: diminishing returns |
5.5. | Barrier films: why go multi-layer |
6. | ROLL-TO-ROLL ULTRA-HIGH PERFORMANCE MULTI-LAYER BARRIER FILMS |
6.1. | Companies reviewed in this chapter |
6.2. | Vitex (Samsung) - the PML process |
6.3. | Vitex (Samsung)- multilayers and dyads |
6.4. | The multilayer barrier and the Vitex flexible glass |
6.5. | Vitex (Samsung)- transitioning to inline |
6.6. | Vitex - hybrid encapsulation and Samsung acquisition |
6.7. | GE - graded barrier |
6.8. | GE - graded barrier - Sabic acquisition |
6.9. | POLO - Fraunhofer |
6.10. | Fraunhofer's R2R multi-layer barrier film |
6.11. | 3M's R2R ML barrier film |
6.12. | All Inorganic R2R Barriers from Vitriflex |
6.13. | Konica Minolta's in-house barrier technology |
6.14. | OptoCapTM Barrier From Aixtron |
6.15. | Holst Centre/TNO R2R SiNx PECVD Barrier |
6.16. | Applied Materials (AM) R2R PECVD |
6.17. | ITRI: Replacing PECVD SiNx in barrier layer with R2R solution coated inorganic layer |
6.18. | Opteria: commercialising multi-layer barrier with solution coated inorganic layers? |
6.19. | Status of R2R barrier films in performance, web width and readiness/scale |
6.20. | Benchmarking different R2R process |
6.21. | Comparison of performance metrics for different encapsulation solutions |
7. | SUBSTRATES FOR R2R MULTI-LAYER BARRIER FILMS |
7.1. | How do common flexible substrates perform as a barrier film? |
7.2. | How does the choke of substrate affect barrier performance? |
7.3. | DuPont Teijin's Peel-Off Substrate |
7.4. | Benchmarking the properties of different substrates |
8. | BARRIER ADHESIVES |
8.1. | Barrier adhesives |
8.2. | Barrier lamination adhesives: area vs edge sealing |
8.3. | Barrier adhesives: 3M |
8.4. | Barrier adhesives: DELO - Henkel |
8.5. | Barrier adhesives: tesa |
8.6. | Transparent flexible barrier adhesives: Ajinomoto |
8.7. | Flexible barrier adhesive with embedded getter |
8.8. | What adhesive performance level is required |
8.9. | What are the reported performance levels? |
9. | IN-LINE DEPOSITED THIN FILM ENCAPSULATION (TFE): ALREADY COMMERCIAL? |
9.1. | TFE is the technology of choice now for plastic and flexible OLED displays |
9.2. | In-line thin film encapsulation vs other approaches |
9.3. | Technology trends: TFE vs. barrier lamination |
9.4. | TFE is the technology of choice now for plastic and flexible OLED displays |
9.5. | Hybrid film-inline approach? |
9.6. | In-line TFE: reducing thickness by cutting the number of layers in the barrier stack |
9.7. | In-line TFE: Past, present and future of deposition methods |
9.8. | In-line TFE: transition from shadow mask to inkjet printing |
9.9. | In-line TFE: process flow with inkjet printing |
9.10. | In-line TFE: transition from inkjet to plasma deposition of organics? |
9.11. | In-line TFE: transitions in inorganic layer deposition from PVD to PECVD and potentially to ALD? |
9.12. | Inline TFE: transition from rigid plastic to flexible OLED displays |
9.13. | TFE: arrangement for bottom encapsulation layer |
9.14. | Multi layer barrier for bottom barrier layer in flexible/rollable displays? |
10. | EMERGING APPROACHES IN INLINE TFE |
10.1. | Kateeva: succeeding where others failed? |
10.2. | TFE: single-chamber organic/inorganic approach (AUO) |
10.3. | ALD inorganic and plasma deposited organic layers (AP System) |
10.4. | CPT: low-temperature multi-layer thin film encapsulation |
10.5. | Tosoh: special PECVD precursor for thin high performance inorganic layers |
11. | ROLL TO ROLL ATOMIC LAYER DEPOSITION |
11.1. | What is atomic layer deposition? |
11.2. | Single layer high performance ALD barrier layer: batch processing |
11.3. | Temporal vs spatial atomic layer deposition: basis for speeding up the process |
11.4. | Roll to roll ALD: Lotus Technologies |
11.5. | Lotus Technology: achieving ultra-thin high-performance barrier with R2R ALD running at high web speeds |
11.6. | TNO: spatial ALD and its first success |
11.7. | TNO: innovative roll to roll spatial ALD |
11.8. | Using R2R ALD for CIGS PV passivation |
11.9. | Beneq: R&D spatial R2R ALD |
11.10. | R2R ALD: challenges with web handling |
11.11. | Pioneering web handling techniques for R2R production |
11.12. | Thin film encapsulation: ALD inorganic and plasma deposited organic layers |
12. | ULTRA-THIN AND FLEXIBLE GLASS |
12.1. | Flexible glass: an assessment |
12.2. | Flexible Glass is not a young technology |
12.3. | Wide size available now? |
12.4. | What is ULTRA thin flexible glass? |
12.5. | Why is that thinness range of interest? |
12.6. | Why are we interested: glass is an excellent barrier |
12.7. | Why are we interested: glass is highly transparent |
12.8. | Why are we interested: high surface smoothness |
12.9. | Why are we interested: high dimensional stability |
12.10. | How are ultra thin glasses made? |
12.11. | Limitations of flexible glass: flexibility |
12.12. | Can we improve the flexibility? |
12.13. | Handling: the Achilles hill? |
12.14. | Complex fast R2R printing already demonstrated |
12.15. | Can we cut the ultra thin flexible glass? |
12.16. | Flexible glass: commercial uptake in OLED lighting? |
12.17. | Summary |
13. | APPLICATIONS: PLASTIC AND/OR FLEXIBLE DISPLAYS |
13.1. | The early years of flexible displays |
13.2. | Flexible EPD suppliers in 2017 |
13.3. | Flexible LCD |
13.4. | First step towards flexible: OLED on plastic substrate |
13.5. | The rise of plastic and flexible AMOLED |
13.6. | Plastic displays in mass production |
13.7. | Rigid plastic OLED displays use inline TFE |
13.8. | But fully flexible displays are finally coming? |
13.9. | Large flexible displays demonstrated by LG |
13.10. | From rigid OLED, to flexible and foldable OLED |
13.11. | Changes in touch technology for flexible displays |
13.12. | Market forecasts for rigid, plastic and flexible OLED displays |
13.13. | Rigid, plastic and flexible OLED displays: market forecasts in sqm split by barrier technologies |
13.14. | Rigid, plastic and flexible OLED displays: market forecasts in value split by barrier technologies |
14. | OLED |
14.1. | Performance and cost targets |
14.1.1. | Performance challenge for OLED lighting |
14.1.2. | Price targets as set by LED and other lighting sources |
14.2. | Sheet-to-sheet OLED lighting production |
14.2.1. | Current state of sheet-to-sheet |
14.2.2. | Existing Sheet-to-Sheet Lines: OLEDWorks in Aachen (ex-Phillips line) |
14.2.3. | Performance data for the OLEDWorks Line |
14.3. | Current status of R2R OLED lighting lines |
14.3.1. | Current status with R2R OLED lighting |
14.3.2. | Pilot Line 1: Fraunhofer FEP in Dresden, Germany |
14.3.3. | Pilot Line 2: Holst Centre in Eindhoven, Netherlands |
14.3.4. | Pi-scale: EU-funded joint development |
14.3.5. | Pilot Line 3: CEREBA in Tsukuba, Japan |
14.3.6. | Konica-Minolta R2R Factory in Kofu, JP |
14.4. | Issues affecting R2R |
14.4.1. | Not touching the front surface |
14.4.2. | Patterning |
14.4.3. | OLED lighting: lifetime is still a weak spot? |
14.4.4. | Will TFE also be used in OLED lighting? |
14.4.5. | OLED lighting market: will it eventually disrupt? |
14.4.6. | OLED lighting: Market forecasts in sqm and value split by barrier technology |
15. | ADDRESSABLE MARKETS: ORGANIC PHOTOVOLTAICS |
15.1. | Organic photovoltaics (OPV): the dream and the reality (so far)? |
15.2. | Basics of OPV operation |
15.3. | Typical OPV device architectures (single vs multi-junction) |
15.4. | Film morphology control (bulk heterojunction) is critical |
15.5. | Solution vs evaporation |
15.6. | Progress in solution processing so far (2010 TO NOW) |
15.7. | Progress in tandem cell evaporation so far (2007 to NOW) |
15.8. | OPV products and prototypes |
15.9. | OPV installations |
15.10. | Current status of commercial players and outlook |
15.11. | Market Forecast for Organic photovoltaics |
15.12. | OPV: barrier market forecasts in sqm and value split by barrier technology |
16. | ADDRESSABLE MARKETS: QUANTUM DOTS |
16.1. | What are quantum dots? |
16.2. | An old technology? |
16.3. | Snapshot of readiness level of various QD applications |
16.4. | Displays: benchmarking various integration methods |
16.5. | QD Technology and Market Roadmap (10 year view) |
16.6. | Ten-year quantum market solution forecasts in value segmented by 12 applications in displays, lighting, sensors, photovoltaics, and so on |
17. | DISPLAYS: ENHANCEMENT FILM OR REMOTE FILM-FILM QD PHOSPHORS |
17.1. | Film type integration: growing commercial success but for how long? |
17.2. | QD film needs to be encapsulated |
17.3. | Quantum Dots: reducing barrier requirements |
17.4. | Fujifilm: Novel honeycomb barrier for QD films |
17.5. | Glass based QD sheet in LCD displays |
17.6. | Quantum dot films: barrier market forecasts in sqm and value split by barrier technology |
18. | ADDRESSABLE MARKETS: FLEXIBLE INORGANIC THIN FILM PHOTOVOLTAICS |
18.1. | R2R photovoltaic production: what has gone wrong? |
18.2. | CIGS photovoltaics |
18.3. | Ascent Solar |
18.4. | Solarion |
18.5. | Global Solar |
18.6. | Barrier requirements for CIGS photovoltaics |
18.7. | Why CIGS need a barrier |
18.8. | Flexible CIGS: market forecasts in sqm and value split by barrier technology |
19. | BARRIER MEASUREMENTS |
19.1. | The calcium test |
19.2. | MOCON |
19.3. | Fluorescent Tracers |
19.4. | Black Spot Analysis |
19.5. | Tritium Test |
19.6. | IMRE |
19.7. | Mass Spectroscopy - gas permeation (WVTR & OTR potential applications) |
19.8. | Kisco Uniglobe |
20. | COMPANY PROFILES |
20.1. | 3M |
20.2. | Amcor |
20.3. | Applied Materials |
20.4. | Asahi Glass Company (AGC) |
20.5. | Beneq |
20.6. | Corning |
20.7. | Duskan |
20.8. | Encapsulix |
20.9. | Fujifilm |
20.10. | Konica Minolta |
20.11. | LG Display |
20.12. | Lotus |
20.13. | Meyer Burger Group |
20.14. | Mitsubishi |
20.15. | Nippon Electric Glass (NEG) |
20.16. | Tera-Barrier Films |
20.17. | TNO Holst Centre |
20.18. | Toppan Printing |
20.19. | Samsung |
20.20. | Schott AG |
20.21. | UDC |
20.22. | Unijet |
20.23. | Vitriflex |
スライド | 322 |
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企業数 | 23 |
フォーキャスト | 2029 |